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TABLE 45.2 Elemental Candidates for Solders Element Antimony Bismuth Copper Gallium Gold Indium Lead Mercury Palladium Platinum Silver Tin Zinc Symbol Sb Bi Cu Ga Au In Pb Hg Pd Pt Ag Sn Zn Melting point ( C) 630.5 217.5 1084.5 29.75 1063 156.3 327.5 38.83 1550 1768.3 960.15 231.89 419.6 Comments Toxic, used as a minor constituent of some solders Already in use Already in use Too expensive Too expensive Too expensive Banned for use in EU Toxic, restricted for use in EU Too expensive Too expensive Expensive but already used in solders in small quantities Already in use Already in use

Table 77 describes the different properties sought for various spindle systems Rolling elements due to their surface-to-surface contact suffer from a lot of drawbacks such as a thermal growth in the process, wear stabilization time and other errors, whereas aerostatic and hydrodynamic bearings are superior in these characteristics Rolling element bearings are better in terms of axial and radial stiffness and also the load carrying capacity for which aerostatic and hydrodynamic bearing are lagging However, due to the many drawbacks, rolling element bearings are less commonly used in ultra-precision machines Both Figure 772 and Table 77 prepared by Weck [37] give a very good insight into the strength and the weakness of each type of bearing together with the applications Figure 773 shows the dimensions of aerostatic, hydrodynamic and ball bearings required for a radial stiffness of about 70,000 N/mm (400,000 lbf/in2) and a maximum radial load capacity of 6675 N (150 lbf) In this comparison, it is assumed that the maximum permissible outer diameter is 100 mm (4 in), whereas the shaft diameter is at least 38 mm (15 in) The comparison can now be made for several parameters such as load capacity, radial stiffness, total power consumption, axis definition and wear Table 77 Properties of different spindle systems for precision applications [37]

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10.8 10.9 10.10 10.11 11.1 11.2 11.3 11.4 11.5 12.1 12.2 12.3 12.4 13.1 13.2 13.3 13.4 14.1 14.2 14.3 14.4 14.5 14.6 14.7

its value, silver, too, can be used only in small proportions for solder and is already in wide use that way today. Given the four remaining metals (Bi, Cu, Sn, and Zn), there are many possible metallurgical permutations available for solder alloying, but there are few that either possess low enough liquidus to be useful for circuit board assembly or have attractive physical properties as a solder. Although Pb-free solders have been in use for many years (jewelry making, plumbing, brazing, etc.), few have been studied sufficiently for electronics assembly, most have too high a melting point to be useful, and none come with the well-documented properties database as is the case for Sn-Pb solder.

Candidate Pb-Free Solders Although many manufacturers completed the conversion to Pb-free soldering in time for the July 1, 2006, implementation of the RoHS directive in Europe, there was still no consensus across the industry for a single tin-lead solder replacement at the time. Pb-free alloy systems receiving the most attention include those listed in the Table 45.3.

TABLE 45.3 List of Lead-Free Solders and Their Temperature Ranges Most common compositionsa (wt %) Sn-0.07Cu Sn-3.5Ag Sn-5.0Ag Sn-3.0Ag-0.05Cu Sn-3.5Ag-0.9Cu Sn-3.5Ag-0.7Cu Sn-3.8Ag-0.7Cu Sn-3.9Ag-0.6Cu Sn-4.0Ag-0.5Cu Sn-1.0Ag-57Bi Sn-3.4Ag-4.8Bi Sn-3.5Ag-5.0Bi Sn-3.5Ag-1.0Bi Sn-2.0Ag-7.5Bi Sn-2.5Ag-1.0Bi-0.5Cu Sn-2.0Ag-3.0Bi-0.75Cu Sn-58Bi Sn-8.0Sn-3.0Bi Sn-9.0Zn Solidus temperatureb ( C) 2273 2213 221 217 217c 217 217 217 217 137 200 208 219 191 214 207 138c 191 199c Liquidusb temperature ( C) 227c 221c 240 221 217c 220 220 223 225 139 216 215 220 216 221 218 138c 198 199c

Notes: a There are too many non-eutectic formulations composed of the same elements in varying ratios to list comprehensively here. Each variation in composition will have its own melting range. The ones listed in this table are examples only to show approximate temperature range and composition. b There are discrepancies in the literature as to the exact melting point or melting range of alloys listed, but the table will be useful for approximating phase-change characteristics of the alloys listed. c Eutectic alloys have a distinct melting point; solidus and liquidus temperatures are the same. Non-eutectic alloy melting is characterized by a melting range where the alloy is present as both solid phase(s) and liquid phase simultaneously (pasty range). At the upper temperature of the melting range, only the liquid phases exist.

Characteristics of spindle systems for high and ultraprecise applications Asynchronous error motion Total error motion Load capacity Wear Radial static stiffness Axial static stiffness Dynamic behaviour Thermal growth Stabilization time : very short Spindle speed Price/cost

45.5.1.1 Characteristics of Pb-Free Solders. Pb-free solders generally exhibit poorer wetting and spreading characteristics than Sn-Pb alloys, but may offer an advantage in tensile strength and creep resistance. In terms of the soldering process, a whole new understanding of the various Pb-free alloys is required. Propensity for solder void formation, solder paste shelf-life, solder

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