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Photograph of a protoboard 201 Phtograph of a general purpose printed circuit board 201 Some useful tools 202 Component site photograph of a prototype under fabrication 204 Solder side photograph of a prototype under fabrication 205 Output LED arrangement for our dice 208 LEDs light up in this fashion for the numbers 1 to 6 209 Block diagram for the electronic dice circuit 210 Schematic for the electronic dice 211 A typical switch connection configuration for connecting to processors or a digital circuit 212 Block diagram for an alternative electronic dice circuit R is a current-limiting resistor for each of the segment LEDs of the 7-segment display 213 Block diagram for another alternative electronic dice circuit R is a current limiting resistor for each of the LEDs The 7 LEDs are again arranged as in Figure 101 214 Photograph of the completed dice circuit board.

In general, by referring to Table 78, the load capacity of the hydrodynamic bearing is closely related to the operating temperature Usually, hydrodynamic bearings are not used for high-speed applications because of the excessive power consumption and heating The maximum radial load of the ball bearings seems to decrease with an increase in speed On the other hand, the load capacity of the aerostatic bearing increases with higher speeds due to an aerodynamic effect Table 78 Comparison of bearing types load capacity modified to include stiffness [3]

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The temperature experienced at wave solder will not cause the Sn-Ag-Cu to reflow, thus preserving the integrity of surface-mount technology (SMT) solder joints In the case of repair or replacement of components, the use of low melting temperature solder will have no adverse thermal effect on adjacent or reverse-side solder joints In fact, use of low melting point solder reduces the possibility of pad delamination or through-hole barrel cracking; failure mechanisms associated with localized overheating, especially at repair 45513 Sn-Ag-Cu As previously stated, the Sn-Ag-Cu (SAC) family is receiving the most attention worldwide Its tensile strength is superior to that of Sn-Pb, but its shear strength is worse It is easily fluxed and moderate in melting temperature roughly 35 C higher than eutectic Sn-Pb solder.

The elevated temperature regime makes this alloy more difficult to flux since the flux tends to dry up and activate too early in the processThis problem is overcome with higher molecular weight resin fluxes and volatile organic compound (VOC)-free flux formulations since there are no alcohols or other low boiling organics present to aid in evaporation The SAC family has good compatibility with most Pb-free board surface finishes and Pb-free component platings Its process window is narrower than that of Sn-Pb It has been demonstrated that SAC can be used with parts containing Pb, but the reliability of the solder joint is less than if soldering Pb d to Sn-Pb or Pb-free to SAC SAC solders sell at about two-and a-half to three times the price of Sn-Pb solder alloys A comparison of Sn-Pb solder to SAC solder is offered in Table 454..

TABLE 45.4 Comparison of Sn-Pb Solder with Pb-Free SAC Solder Tin/Lead Sn63:Pb 183 C ~215 10 C 250 C 260 C Adequate Adequate Tin-Silver-Copper Sn-(3.0 4.0%)Ag-(0.5 0.7%)Cu ~217 C ~221 C ~240 10 C 260 C 270 C (with higher preheats and longer soldering dwells) Collecting data Collecting data

Figure 453 demonstrates the process temperature differences for Sn-Pb soldering compared to SAC A condition known as sporadic brittle fracture has been reported and may be related to the use of SAC alloy soldered to electroplate gold over electroplate nickel It is most often associated with BGA solder ball-to-BGA package attach, but may also occur in board-level solder joints at the BGA ball-PWB interface The root cause of failure is still unknown 45514 Sn-07Cu Alloy Eutectic Sn-Cu (mp, 227 C) is being used as a wave solder charge material It is compatible with most board surface finishes and component lead-frame finishes Its relatively low cost (about 50 percent more than Sn-Pb solder) makes it an attractive Pb-free alternative It also has been demonstrated to be an effective alloy for Pb-free hotair solder-leveled (HASL) surfaces on PWBs.

Maximum radial load (lbf) at 3,000 rpm at 20,000 rpm 95 1,050 5,000 (40 C) 1,900 120 600 Radial static stiffness

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