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One problem with Sn-Cu alloy, especially at wave soldering or fountain soldering, is that small amounts of dissolved copper will cause a dramatic rise in the melting point of the alloy The high melting temperature of this alloy causes rapid material dissolution from PWB surfaces and component lead platings Care must be taken to top off the wave solder pot with an appropriate amount of Sn or Sn-Cu to maintain proper Sn-Cu alloy proportions 45515 Indium Alloys This metal and its effect on the solder joint is very much the same as for bismuth Indium (In) is very soft and ductile in its elemental form and melts at about 157 C In-based soldering alloys are much more expensive about 25 times that of Sn-Pb due to indium s scarcity, thus it is not suited as a dominant metal in solder.

Price and supply make it unattractive even as a trace agent or a minor solder alloy constituent10 B Allenby et al11 concluded that the world s indium supply would be depleted in about one year if indium were consumed at the same rate as Pb An In-Sn eutectic occurs at 58 wt percent In with a eutectic point temperature of 120 C It forms intermetallic compounds with copper from the circuit board s bonding pad or copperbased component leads Copper is highly soluble in indium12 Indium has been demonstrated to be of value in reducing the leaching of gold into solder F Yost13 reported a lower Au dissolution rate for indium-based solders as compared to Sn solders The use of indium allows soldering to gold films without thoroughly consuming the gold.

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217 Photograph of the solder side of the dice circuit board 218 Possible sources of supply voltage for the dice circuit 220 Block diagram for the electronic dice using an AT90S2343 221 Block diagram of the Morse keyer 226 Circuit schematic for the Morse keyer 227 Oscillogram for Morse code output for DOT, generated by the keyer circuit 230 Oscillogram for Morse code output for DASH, generated by the keyer circuit 230 Oscillogram for Morse code output for the character U, generated by the keyer circuit 231 Block diagram for the dual-channel voltmeter with LCD 234 Circuit schematic for a dual-channel voltmeter with an LCD display 236 Photograph of the dual-channel voltmeter 237 Logic analyzer screen capture of the MAX111 ADC readout by the AT90S2313 controller 237 Block diagram of the simple kitchen timer 240 Circuit schematic for the kitchen timer 241 Photograph of the kitchen timer.

The resulting solder joints are not brittle, as is the case of Sn-based solder joints exposed to too much gold..

Indium and some of its alloys can wet to glass, quartz, and other normally unsolderable inorganic substrates with the aid of an ultrasonic soldering tool. Ultrasonic soldering will be discussed in the chapter on soldering techniques. 45.5.1.6 Zinc Solders. Zinc (Zn) alloys, favored by some Japanese companies, oxidize rapidly. Solder paste shelf-life has been an issue even when these alloys are refrigerated at very low temperatures. Dross formation in wave soldering has also been problematic. Zn alloys are also known to have some corrosion problems.

Aerostatic (e = 05) Ball bearing Hydrodynamic Hydrostatic (e = 05)

Most every circuit board consists of a stack-up of insulator material such as fiberglass and conductive layers composed of copper. Copper oxidizes quickly and its oxides are somewhat chemical-resistant, making it tough to solder without aggressive fluxing. Copper also corrodes in the long term from left-over process residues, fingerprints (body salts), or airborne contaminants. It is for these reasons that copper traces and solder lands on circuit boards are protected by solder mask, plating, or other surface treatments. The following section covers the most common board finishes. The process engineer needs to bear in mind that in addition to solderability, other surface finish related issues may affect manufacturing or cost, including the following:

Probe-ability This is the ease with which conventional in-circuit test probes are able to penetrate surface oxides or solder flux residue. Tribology The frictional properties of a material become important for press-fit connections. Cost Some surface finishes are significantly more expensive than others. Shelf-life This is the ability of a surface finish to resist oxidation or other surface conversion or corrosion and remain solderable. Reliability This refers to the resultant solder joint strength as it relates to long-term use and resistance to shock, vibration, and other environmental factors. Corrosion resistance Some surface finishes are more prone to corrosion than others. Immersion silver and copper are two such finishes. Other surface finish related defects Immersion silver (Imm-Ag) sometimes exhibits linear arrays of microvoids at the intermetallic interface which detracts from solder joint strength. Electroless nickel/immersion gold (ENIG) sometimes results in brittle fracture if the plating chemistries are not maintained properly.

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