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Hot Air Solder Leveled Surfaces HASL coated boards have been the industry mainstay and the most common board surface finish worldwide. HASL is generally eutectic or near-eutectic Sn-Pb flowed onto exposed surface pads and traces on a finished PWB at the board shop prior to electronic assembly. It is inexpensive, eminently solderable, and easy to apply, and has excellent shelf-life/aging properties.There is the old adage in the industry that nothing solders like solder, which has made HASL a safe and preferred finish for many years. Previously it was thought that the HASL process could not deliver flat enough pads for fine-pitch surface-mount. Now it is a wellproven surface finish for component lead pitches down to at least 0.5 mm. Reputable board shops no longer consider HASL difficult to apply. RoHS for the most part marks the impending demise of the Sn-Pb HASL surface finish. There are efforts to find other metallurgies to extend the useful life of HASL equipment.

Sn-Cu has been demonstrated to be one such HASL coating material Studies are underway to determine long-term reliability impact of this change in material on the board and resultant solder joints 4562 Organic Solder-Preservative-Copper Known as OSP-Cu,14,15 organic solder-preservative-copper is a treatment and organic coating applied to the copper lands on the PWB at the board shop The lands are first given a microetch to remove oxides and to increase surface area for OSP coating adhesion The protective coating is an organometallic compound such as benzotriazole or imidazole, that chemically bonds with the freshly etched copper bonding pads and PTHs of the PWB The coating retards copper oxidation and is meant to retain copper solderability through multiple reflow cycles OSP-Cu is widely used and best for just-in-time board assembly strategies since its useful life is time-, temperature- and humidity-dependent.

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242 Photograph of a pair of thumbwheel switches used with the kitchen timer 243 Block diagram of a radio beacon 246 Morse output for my callsign VU2NOX 248 Block diagram of a radio beacon controller using the Tiny22 processor 249 Flowchart for the beacon controller program 250 Circuit schematic for the radio beacon controller 251 Photograph of the beacon circuit board 252 Scope trace for the audio sidetone as well as the transmitter key switch output generated by the beacon controller The trace shows 4 morse codes for the characters C Q C Q 253 Using a PC and an external data acquisition system for recording data 256 An autonomous data acquisition system 257 Block diagram of SniffStick 258 Block diagram of the PC parallel-port-based docking port for the SniffStick DAS 258 Circuit schematic for the SniffStick 259.

During the soldering process, the organic coating degrades with each reflow cycle, allowing increasing levels of copper oxidationThe chemical-resistant copper oxide inhibits solder wetting, requiring ever stronger solder fluxes This is particularly the case with thick {236 mm (0093 in) or greater}, thermally aggressive boards with mixed-mount technology Reflow results on the secondary side and primary side of such boards are generally satisfactory But by the time such a board goes through wave soldering, the OSP coating has largely lost its effectiveness in preventing copper oxidation and incomplete barrel fill may result on PTH component soldering When solder paste printing goes awry and the PWB needs to be cleaned of the misprinted or smeared solder paste, most organic solvents used for removing the paste can remove, thin, or react with the OSP coating reducing its effectiveness in preventing copper oxidation.

The radial stiffness of a journal bearing depends on the stiffness of the shaft, the bearing bush, the quill body and the support structure In addition, for the hydrodynamic bearing, this also depends on the lubricant film A practical stiffness value between 875 and 175 N/ m (500,000 and 1,000,000 lbf/in) is possible for quill assemblies employing hydrodynamic bearings On the other hand, ball bearings and aerostatic bearings are capable of exhibiting stiffness between 4375 and 875 N/ m (250,000 and 500,000 lbf/in) It is also noted that ball bearings allow for a larger shaft diameter for a better rigidity In general, by referring to Table 79, it is seen that the power consumption for the aerostatic bearing is the lowest because of the low value of friction torque in the gas film This also indicates that very little heat is generated and that thermal distortion is seldom a problem The power consumption due to the compressor should also be considered for the aerostatic bearing However, with inclusion, the total power consumed is still relatively lower than that of the hydrodynamic bearings Ball bearings consume the least total power at low speeds because they are independent of any external lubrication and cooling However, at elevated speeds, friction heat is produced during the operation and the total is even higher than the total combined power consumed by aerostatic bearings

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